Invention Grant
- Patent Title: Diamond cutting tools
- Patent Title (中): 钻石切割工具
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Application No.: US13610838Application Date: 2012-09-11
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Publication No.: US09545024B2Publication Date: 2017-01-10
- Inventor: Napthaneal Y. Tan , Chien-Ming Huang , Long Hin Lee , Lu Guojin , Yu Yundi , Lv Peng , Yu Yifeng , Wu Chendong , Shi Ze
- Applicant: Napthaneal Y. Tan , Chien-Ming Huang , Long Hin Lee , Lu Guojin , Yu Yundi , Lv Peng , Yu Yifeng , Wu Chendong , Shi Ze
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: B23C5/12
- IPC: B23C5/12 ; H05K5/04 ; B23P11/00 ; B23P17/00 ; G03F1/38 ; H01Q1/24 ; H04M1/02 ; H05K5/02 ; H05K13/00 ; C25D11/02 ; C25D7/00 ; C25D11/12 ; H05K5/03 ; H01Q1/42 ; C25D11/34 ; B23C5/10 ; B23C5/00 ; B23P17/02 ; H04M1/11 ; C25D11/24

Abstract:
The embodiments described herein relate to methods, systems, and structures for cutting a part to form a highly reflective and smooth surface thereon. In some embodiments, the part includes substantially horizontal and vertical surfaces with edges and corners. In described embodiments, a diamond cutter is used to cut a surface of the part during a milling operation where the diamond cutter contacts the part a number of times with each rotation of the spindle of a milling machine. The diamond cutter has a cutting edge and a land. The cutting edge cuts the surface of the part and the land burnishes the surface of the part to form a highly reflective and smooth surface. Thus, the diamond cutter cuts and burnishes portions of the part, thereby eliminating a subsequent polishing step.
Public/Granted literature
- US20130322975A1 DIAMOND CUTTING TOOLS Public/Granted day:2013-12-05
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