Invention Grant
- Patent Title: Electronic component module and an assembly including the same
- Patent Title (中): 电子元件模块及其组件
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Application No.: US14612271Application Date: 2015-02-02
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Publication No.: US09545026B2Publication Date: 2017-01-10
- Inventor: Toshiyuki Fukuda , Keisuke Kodera , Fumito Itou , Toshihiro Miyoshi
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2012-172685 20120803
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H01L23/00 ; H01L25/16 ; H01L23/13 ; H01L23/34 ; H01L23/367 ; H01L23/538 ; H01L23/66
Abstract:
An electronic component module includes a board, a plurality of external terminals provided on a first surface of the board, and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals. The first semiconductor chip protrudes more along a normal to the first surface than ends of the external terminals do.
Public/Granted literature
- US20150181739A1 ELECTRONIC COMPONENT MODULE AND AN ASSEMBLY INCLUDING THE SAME Public/Granted day:2015-06-25
Information query
