Invention Grant
- Patent Title: Automatic wire connecting device
- Patent Title (中): 自动接线装置
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Application No.: US13981246Application Date: 2012-01-20
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Publication No.: US09545681B2Publication Date: 2017-01-17
- Inventor: Zhengyong Liu , Rintaro Nagaoka
- Applicant: Zhengyong Liu , Rintaro Nagaoka
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-024274 20110207
- International Application: PCT/JP2012/051258 WO 20120120
- International Announcement: WO2012/108250 WO 20120816
- Main IPC: B23H7/10
- IPC: B23H7/10 ; B23H7/08

Abstract:
An automatic wire connecting device includes a heating electrode that heats an electrode wire by applying a current to the electrode wire, a tension applying unit that applies a tension to the electrode wire to which the current is applied by the heating electrode, a tension control unit that controls the tension applied by the tension applying unit, and a power supply control unit that applies a heating current smaller than a preset annealing current to the electrode wire until a first set time elapses since the current starts to be applied and increases the current applied to the electrode wire to reach the annealing current during a second set time after the first set time elapses since the current starts to be applied.
Public/Granted literature
- US20130299459A1 AUTOMATIC WIRE CONNECTING DEVICE Public/Granted day:2013-11-14
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