Invention Grant
- Patent Title: Hermetically sealed electronic device using solder bonding
- Patent Title (中): 密封电子器件采用焊接
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Application No.: US14931957Application Date: 2015-11-04
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Publication No.: US09545682B2Publication Date: 2017-01-17
- Inventor: Srinivasan Sridharan , Robert P. Blonski , Chandrashekhar S. Khadilkar , John J. Maloney
- Applicant: Ferro Corporation
- Applicant Address: US OH Mayfield Heights
- Assignee: Ferro Corporation
- Current Assignee: Ferro Corporation
- Current Assignee Address: US OH Mayfield Heights
- Agency: Rankin, Hill & Clark LLP
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K1/00 ; H01L23/10 ; B23K1/19 ; H01L31/048 ; H01L31/18 ; H05K13/00 ; B23K1/002 ; B23K1/005 ; B23K1/06 ; B23K35/26 ; C03C27/08 ; H01G9/20 ; H01L51/52
Abstract:
Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.
Public/Granted literature
- US20160059339A1 Hermetically Sealed Electronic Device Using Solder Bonding Public/Granted day:2016-03-03
Information query
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