Invention Grant
- Patent Title: Automated hole generation
- Patent Title (中): 自动生成孔
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Application No.: US12419054Application Date: 2009-04-06
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Publication No.: US09545697B2Publication Date: 2017-01-17
- Inventor: Eric Whinnem , Gary A. Lipczynski , John A. Baumann
- Applicant: Eric Whinnem , Gary A. Lipczynski , John A. Baumann
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: B23B39/00
- IPC: B23B39/00 ; B23B47/00 ; B23B47/28 ; B23Q1/54 ; B23Q9/00

Abstract:
A method for performing operations on a structure. A moveable platform may be positioned in an area relative to the structure to define a working envelope. The moveable platform may be connected to a tool that may be moved around a plurality of axes within the working envelope using the moveable platform. The tool may be moved to a plurality of locations within the working envelope using the moveable platform. An operation may be performed with the tool through the working envelope at each of the plurality of locations using the moveable platform.
Public/Granted literature
- US20100254778A1 Automated Hole Generation Public/Granted day:2010-10-07
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