Invention Grant
- Patent Title: Method of reducing tungsten film roughness and resistivity
- Patent Title (中): 降低钨膜粗糙度和电阻率的方法
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Application No.: US13968144Application Date: 2013-08-15
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Publication No.: US09546419B2Publication Date: 2017-01-17
- Inventor: Amit Khandelwal , Avgerinos V. Gelatos
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: C23C16/06
- IPC: C23C16/06 ; C23C16/02 ; C23C16/14 ; C23C16/455

Abstract:
Methods for controlling crystal size in bulk tungsten layers are disclosed herein. Methods for depositing a bulk tungsten metal layer can include positioning a substrate with a barrier layer in a processing chamber, forming a tungsten nucleation layer, post-treating the nucleation layer with one or more treatment gas cycles including an activating gas and a purging gas, heating the substrate to a deposition temperature, and depositing a bulk tungsten layer with alternating nitrogen flow on the nucleation layer. The post-treatment cycling can be applied optionally to the bulk metal deposition with alternating nitrogen flow.
Public/Granted literature
- US20140147589A1 METHOD OF REDUCING TUNGSTEN FILM ROUGHNESS AND RESISTIVITY Public/Granted day:2014-05-29
Information query
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