Invention Grant
US09546546B2 Multi chip module housing mounting in MWD, LWD and wireline downhole tool assemblies
有权
多芯片模块外壳安装在MWD,LWD和电缆井下工具组件中
- Patent Title: Multi chip module housing mounting in MWD, LWD and wireline downhole tool assemblies
- Patent Title (中): 多芯片模块外壳安装在MWD,LWD和电缆井下工具组件中
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Application No.: US14276331Application Date: 2014-05-13
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Publication No.: US09546546B2Publication Date: 2017-01-17
- Inventor: Carsten Haubold , Andreas Peter , Michell Schimanski , Christian Preiser
- Applicant: BAKER HUGHES INCORPORATED
- Applicant Address: US TX Houston
- Assignee: BAKER HUGHES INCORPORATED
- Current Assignee: BAKER HUGHES INCORPORATED
- Current Assignee Address: US TX Houston
- Agency: Mossman, Kumar & Tyler PC
- Main IPC: E21B47/01
- IPC: E21B47/01 ; E21B36/00 ; H05K5/02

Abstract:
An apparatus for protecting an electronics module used in a borehole includes a borehole string section having an outer circumferential surface on which at least one pocket is formed, a mount associated with the at least one pocket, and a sleeve surrounding the section of the borehole string. The mount includes a housing, a lid, and a biasing member. The housing receives the electronics module and is seated on a seating surface of the at least one pocket. The lid encloses the housing within the at least one pocket. The biasing member is positioned between the lid and the housing. The sleeve presses the lid against the biasing member and the biasing member may responsively urge the housing against the seating surface. Related methods include protecting the electronics module with the mount.
Public/Granted literature
- US20150330208A1 MULTI CHIP MODULE HOUSING MOUNTING IN MWD, LWD AND WIRELINE DOWNHOLE TOOL ASSEMBLIES Public/Granted day:2015-11-19
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