Invention Grant
- Patent Title: Non-metallic expansion/deflection coupling modules
- Patent Title (中): 非金属膨胀/偏转耦合模块
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Application No.: US13964667Application Date: 2013-08-12
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Publication No.: US09546749B2Publication Date: 2017-01-17
- Inventor: Andy Ali Jaffari
- Applicant: Andy Ali Jaffari
- Applicant Address: US DE Wilmington
- Assignee: THOMAS & BETTS INTERNATIONAL, LLC
- Current Assignee: THOMAS & BETTS INTERNATIONAL, LLC
- Current Assignee Address: US DE Wilmington
- Agency: Butler Snow LLP
- Main IPC: F16L27/10
- IPC: F16L27/10 ; F16L27/08 ; F16L27/02 ; F16L47/18 ; F16L51/02 ; F16L27/00
Abstract:
An improved device for coupling rigid non-metallic conduits is disclosed. The claimed device is capable of allowing movement in an axial direction due to expansion and contraction and can also compensate for angular or parallel deflection of the conduits.
Public/Granted literature
- US20130334812A1 NON-METALLIC EXPANSION/DEFLECTION COUPLING MODULES Public/Granted day:2013-12-19
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