Invention Grant
US09546763B2 Flexible circuit board with graphite substrate and circuit arrangements using same
有权
带石墨基板的柔性电路板和使用相同的电路布置
- Patent Title: Flexible circuit board with graphite substrate and circuit arrangements using same
- Patent Title (中): 带石墨基板的柔性电路板和使用相同的电路布置
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Application No.: US14809193Application Date: 2015-07-25
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Publication No.: US09546763B2Publication Date: 2017-01-17
- Inventor: Alexander J. Augoustidis , Gregory P. Kramer , Robert Anderson Reynolds, III
- Applicant: GrafTech International Holdings Inc.
- Applicant Address: US OH Brooklyn Heights
- Assignee: GrafTech International Holdings Inc.
- Current Assignee: GrafTech International Holdings Inc.
- Current Assignee Address: US OH Brooklyn Heights
- Agent Patrick D. Floyd
- Main IPC: H05K1/00
- IPC: H05K1/00 ; F21K99/00 ; F21V29/83 ; H05K1/03 ; F21V29/70 ; F21V29/85 ; H05B33/06 ; H05B33/12 ; H05K1/05 ; H05K3/44 ; H05K7/20 ; H05K1/09 ; H05K1/02 ; H05K3/24

Abstract:
A flexible circuit board having a flexible graphite substrate is provided. The flexible circuit board includes a dielectric layer formed on the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. Electronic components are mounted to the flexible circuit board to form a circuit arrangement. A thermally conductive conduit can be disposed in thermal and physical contact with a surface of the electronic component and the surface of the flexible graphite substrate to. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the electronic components for improved cooling of the heat generating electronic component and surrounding devices.
Public/Granted literature
- US20160029480A1 FLEXIBLE CIRCUIT BOARD WITH GRAPHITE SUBSTRATE AND CIRCUIT ARRANGEMENTS USING SAME Public/Granted day:2016-01-28
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