Invention Grant
- Patent Title: Heat exchanger
- Patent Title (中): 热交换器
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Application No.: US13317731Application Date: 2011-10-27
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Publication No.: US09546824B2Publication Date: 2017-01-17
- Inventor: Kang Tae Seo , Hong Gi Cho , Hayase Gaku
- Applicant: Kang Tae Seo , Hong Gi Cho , Hayase Gaku
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: KR10-2010-0106372 20101028
- Main IPC: F28D1/053
- IPC: F28D1/053 ; F28F9/02

Abstract:
A heat exchanger includes first and second heat exchanging units arranged between first and second header units, and a plurality of refrigerant circuits each defining a refrigerant path, through which refrigerant introduced into the first header unit is discharged out of the first header unit after exchanging heat in the first and second heat exchanging units.
Public/Granted literature
- US20120103585A1 Heat exchanger Public/Granted day:2012-05-03
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