Invention Grant
- Patent Title: Monolithic integrated circuit die having modular die regions stitched together
- Patent Title (中): 具有拼接模块的单片集成电路芯片
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Application No.: US13935066Application Date: 2013-07-03
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Publication No.: US09547034B2Publication Date: 2017-01-17
- Inventor: Rafael C. Camarota
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent W. Eric Webostad; Steven Roberts
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/3185 ; G01R31/317 ; H03K19/177
Abstract:
An apparatus for a monolithic integrated circuit die is disclosed. In this apparatus, the monolithic integrated circuit die has a plurality of modular die regions. The modular die regions respectively have a plurality of power distribution networks for independently powering each of the modular die regions. Each adjacent pair of the modular die regions is stitched together with a respective plurality of metal lines.
Public/Granted literature
- US20150008954A1 MONOLITHIC INTEGRATED CIRCUIT DIE HAVING MODULAR DIE REGIONS STITCHED TOGETHER Public/Granted day:2015-01-08
Information query
