Invention Grant
US09547343B2 Flow guiding mechanism and related heat dissipating module and electronic device having the flow guiding mechanism 有权
导流机构及相关散热模块及具有流动引导机构的电子装置

  • Patent Title: Flow guiding mechanism and related heat dissipating module and electronic device having the flow guiding mechanism
  • Patent Title (中): 导流机构及相关散热模块及具有流动引导机构的电子装置
  • Application No.: US14875691
    Application Date: 2015-10-05
  • Publication No.: US09547343B2
    Publication Date: 2017-01-17
  • Inventor: Shih-Huai ChoKuan-Hsun Lu
  • Applicant: Wistron Corporation
  • Applicant Address: TW New Taipei
  • Assignee: Wistron Corporation
  • Current Assignee: Wistron Corporation
  • Current Assignee Address: TW New Taipei
  • Agent Winston Hsu; Scott Margo
  • Priority: TW104111668A 20150410
  • Main IPC: G06F1/20
  • IPC: G06F1/20 H05K7/20
Flow guiding mechanism and related heat dissipating module and electronic device having the flow guiding mechanism
Abstract:
A flow guiding mechanism with flow channel adjusting function is suitable to a heat dissipating module and an electronic device with an interface card. The flow guiding mechanism includes a supporting component, at least one ventilative structure and a plurality of sheltering components. The interface card is assembled with the supporting component in an assembly direction. The ventilative structure includes a plurality of openings, and the plurality of openings is formed on the supporting component in the assembly direction. The plurality of sheltering components is rotatably disposed on the supporting component. One of the plurality of sheltering components covers a corresponding opening of the plurality of openings while the interface card does not contact the foresaid sheltering component, and the interface card rotates the foresaid sheltering component relative to the supporting component to expose the corresponding opening while the interface card is assembled with the supporting component.
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