Invention Grant
US09548134B2 Semiconductor integrated circuit device and multi chip package including the same 有权
半导体集成电路器件与多芯片封装相同

Semiconductor integrated circuit device and multi chip package including the same
Abstract:
A semiconductor integrated circuit device includes a first circuit block configured to receive data from a plurality of data I/O (input/output) lines and output test data in a test mode, and a second circuit block configured to connect the plurality of data I/O lines and the first circuit block, output the data of the plurality of data I/O lines in a normal mode and output the test data provided from the first circuit block in the test mode.
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