Invention Grant
- Patent Title: Semiconductor integrated circuit device and multi chip package including the same
- Patent Title (中): 半导体集成电路器件与多芯片封装相同
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Application No.: US14693426Application Date: 2015-04-22
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Publication No.: US09548134B2Publication Date: 2017-01-17
- Inventor: Byung Deuk Jeon
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK HYNIX INC.
- Current Assignee: SK HYNIX INC.
- Current Assignee Address: KR Icheon-si
- Agency: William Park & Associates Ltd.
- Priority: KR10-2012-0041364 20120420
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G11C8/12 ; G11C29/12 ; G11C29/26 ; G11C7/10 ; G11C11/40

Abstract:
A semiconductor integrated circuit device includes a first circuit block configured to receive data from a plurality of data I/O (input/output) lines and output test data in a test mode, and a second circuit block configured to connect the plurality of data I/O lines and the first circuit block, output the data of the plurality of data I/O lines in a normal mode and output the test data provided from the first circuit block in the test mode.
Public/Granted literature
- US20150228356A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MULTI CHIP PACKAGE INCLUDING THE SAME Public/Granted day:2015-08-13
Information query