Invention Grant
- Patent Title: 3D multipath inductor
- Patent Title (中): 3D多路径电感
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Application No.: US14558411Application Date: 2014-12-02
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Publication No.: US09548158B2Publication Date: 2017-01-17
- Inventor: Robert A. Groves , Sarath L. K. Parambil , Venkata Nr. Vanukuru
- Applicant: GLOBALFOUNDRIES, INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick, LLC
- Agent David Cain
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F41/04 ; H01F17/00

Abstract:
A three-dimensional multipath inductor includes turns disposed about a center region on two layers, the turns on the two layers having corresponding geometry therebetween. Each of the turns is comprised of two or more segments that extend length-wise along the turns, and the segments have positions that vary from an innermost position relative to the center region and an outermost position relative to the center region. A lateral cross-over is configured to couple the segments of at least one turn on one layer with the segments on a turn on a same layer to form segment paths that have a substantially same length for all segment paths in a grouping of segment paths on that same layer. A vertical cross-over is configured to couple the segments on different vertically stacked metal layers to have the segment groups with a substantially same length for all segment paths based on vertical lengths.
Public/Granted literature
- US20160155558A1 3D Multipath Inductor Public/Granted day:2016-06-02
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