Invention Grant
- Patent Title: Attaching apparatus
- Patent Title (中): 安装设备
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Application No.: US14408903Application Date: 2013-05-07
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Publication No.: US09548232B2Publication Date: 2017-01-17
- Inventor: Junichi Katsuragawa , Yoshihiro Inao , Shigeru Kato
- Applicant: Tokyo Ohka Kogyo Co., Ltd.
- Applicant Address: JP Kawasaki-shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2012-139213 20120620
- International Application: PCT/JP2013/062816 WO 20130507
- International Announcement: WO2013/190926 WO 20131227
- Main IPC: B32B37/00
- IPC: B32B37/00 ; H01L21/683 ; B32B37/10 ; H01L21/67 ; B32B37/12 ; B32B41/00
Abstract:
An attaching apparatus, a substrate and a support that can be uniformly attached through an adhesive layer. The attaching apparatus is equipped with a set plate and a press plate formed of ceramics. The set plate and the press plate have a flatness of 1.0 μm or less when not pressed.
Public/Granted literature
- US20150325463A1 ATTACHING APPARATUS Public/Granted day:2015-11-12
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