Invention Grant
- Patent Title: Isolation rings for packages and the method of forming the same
- Patent Title (中): 封装隔离环及其形成方法
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Application No.: US14724954Application Date: 2015-05-29
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Publication No.: US09548245B2Publication Date: 2017-01-17
- Inventor: Chih-Horng Chang , Tin-Hao Kuo , Tsung-Fu Tsai , Min-Feng Ku
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/00 ; H01L21/82 ; H01L21/56 ; H01L21/304 ; H01L23/31
Abstract:
A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.
Public/Granted literature
- US20150262882A1 Isolation Rings for Packages and the Method of Forming the Same Public/Granted day:2015-09-17
Information query
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