Invention Grant
US09548255B1 IC package having non-horizontal die pad and flexible substrate therefor
有权
IC封装具有非水平管芯焊盘和柔性基板
- Patent Title: IC package having non-horizontal die pad and flexible substrate therefor
- Patent Title (中): IC封装具有非水平管芯焊盘和柔性基板
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Application No.: US15139331Application Date: 2016-04-27
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Publication No.: US09548255B1Publication Date: 2017-01-17
- Inventor: You Ge , Meng Kong Lye , Zhijie Wang
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charles E. Bergere
- Priority: CN201510624670 20150817
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/367 ; H01L23/498 ; H01L23/31 ; H01L23/16 ; H01L25/065 ; H01L21/56 ; H01L25/00 ; H01L21/48 ; H01L21/54
Abstract:
An integrated circuit (IC) package has a base, side walls mechanically connected to the base, IC dies respectively mounted on inner surfaces of the side walls or the base, and electrical connections connecting a corresponding IC die to another component of the IC package. In one embodiment, each die is electrically connected to only bond pads on its corresponding side wall or base. Each such side wall and the base have routing structures (e.g., copper traces) that connect each bond pad to another component of the IC package. The IC package is assembled using a flexible substrate that has side regions that rotate relative to the base such that the routing structures do not break. By connecting an IC die only to bond pads on its corresponding side wall or base with bond wires, the bond wires will not break during side-wall rotation.
Information query
IPC分类:
