Invention Grant
US09548257B2 Semiconductor device structures comprising polycrystalline CVD diamond with improved near-substrate thermal conductivity
有权
包括具有改进的近底板导热性的多晶CVD金刚石的半导体器件结构
- Patent Title: Semiconductor device structures comprising polycrystalline CVD diamond with improved near-substrate thermal conductivity
- Patent Title (中): 包括具有改进的近底板导热性的多晶CVD金刚石的半导体器件结构
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Application No.: US14909791Application Date: 2014-08-29
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Publication No.: US09548257B2Publication Date: 2017-01-17
- Inventor: Firooz Nasser-Faili
- Applicant: RFHIC Corporation
- Applicant Address: KR Anyang
- Assignee: RFHIC CORPORATION
- Current Assignee: RFHIC CORPORATION
- Current Assignee Address: KR Anyang
- Agency: Patent Office of Dr. Chung Park
- Priority: GB1319117.6 20131030
- International Application: PCT/US2014/053544 WO 20140829
- International Announcement: WO2015/031833 WO 20150305
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L21/02 ; C23C16/02 ; C23C16/27 ; H01L29/20

Abstract:
A semiconductor device structure includes a layer of III-V compound semiconductor material, a layer of polycrystalline CVD diamond material, and an interface region with a diamond nucleation layer. A Raman signal of the diamond nucleation layer exhibits an sp3 carbon peak at 1332 cm−1 having a full width half maximum of no more than 5.0 cm−1, and one or both of: (i) an sp2 carbon peak at 1550 cm−1 having a height which is no more than 20% of a height of the sp3 carbon peak at 1332 cm−1 after background subtraction when using a Raman excitation source at 633 nm; and (ii) the sp3 carbon peak at 1332 cm−1 is no less than 10% of local background intensity in a Raman spectrum using a Raman excitation source at 785 nm. An average nucleation density at a nucleation surface is no less than 1×108 cm−2 and no more than 1×1012 cm−2.
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