Invention Grant
- Patent Title: Reticle for non-rectangular die
- Patent Title (中): 非矩形模具的标线片
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Application No.: US14947787Application Date: 2015-11-20
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Publication No.: US09548274B1Publication Date: 2017-01-17
- Inventor: Chen-Hua Yu , Ming-Fa Chen , Sung-Feng Yeh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L25/00 ; H01L21/78 ; H01L23/538 ; H01L21/268 ; H01L21/3065 ; H01L27/088 ; H01L27/092
Abstract:
The present disclosure provides a semiconductor structure. The semiconductor structure includes a non-rectangular die area, a dicing ring and a reticle area surrounding the non-rectangular die. The dicing ring is within the reticle area and surrounds the non-rectangular die area. The number of edges of the reticle area is not equal to 4.
Information query
IPC分类:
