Invention Grant
- Patent Title: Solder pad for semiconductor device package
- Patent Title (中): 半导体器件封装焊盘
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Application No.: US14243649Application Date: 2014-04-02
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Publication No.: US09548280B2Publication Date: 2017-01-17
- Inventor: Vijay Sarihan , Zhiwei Gong , Scott M. Hayes
- Applicant: Freescale Semiconductor, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, INC.
- Current Assignee: NXP USA, INC.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K1/11
Abstract:
A solder ball pad for mounting a solder ball of a semiconductor device for preventing delamination of an overlying dielectric layer, and particularly devices and methods providing improved solder ball pad structures in a device such as a semiconductor device package.
Public/Granted literature
- US20150287685A1 Solder Pad for Semiconductor Device Package Public/Granted day:2015-10-08
Information query
IPC分类:
