Invention Grant
US09548290B2 Semiconductor device having magnetic alignment marks and underfill resin layers
有权
具有磁对准标记和底部填充树脂层的半导体器件
- Patent Title: Semiconductor device having magnetic alignment marks and underfill resin layers
- Patent Title (中): 具有磁对准标记和底部填充树脂层的半导体器件
-
Application No.: US13487163Application Date: 2012-06-02
-
Publication No.: US09548290B2Publication Date: 2017-01-17
- Inventor: Satoru Wakiyama , Masaki Minami
- Applicant: Satoru Wakiyama , Masaki Minami
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2011-129192 20110609
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L25/00 ; H01L23/00 ; H01L25/065 ; H01L27/146
Abstract:
A semiconductor device includes a semiconductor element, a connection electrode formed on the semiconductor element, and alignment marks formed on the semiconductor element. At least one of the alignment marks is made of a magnetic material.
Public/Granted literature
- US20120313236A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE Public/Granted day:2012-12-13
Information query
IPC分类:
