Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
- Patent Title (中): 半导体装置及半导体装置的制造方法
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Application No.: US14922524Application Date: 2015-10-26
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Publication No.: US09548365B2Publication Date: 2017-01-17
- Inventor: Junji Kotani , Norikazu Nakamura
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2014-250794 20141211
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/207 ; H01L29/66 ; H01L29/778

Abstract:
A semiconductor device includes: a buffer layer formed over a substrate; a first semiconductor layer formed over the buffer layer by using a compound semiconductor; a second semiconductor layer formed over the first semiconductor layer by using a compound semiconductor; and a gate electrode, a source electrode, and a drain electrode formed over the second semiconductor layer, wherein the first semiconductor layer contains an impurity element serving as an acceptor and an impurity element serving as a donor; and in the first semiconductor layer, an acceptor concentration of the impurity element serving as the acceptor is greater than a donor concentration of the impurity element serving as the donor; and the donor concentration is greater-than over equal to 5×1016 cm−3.
Public/Granted literature
- US20160172478A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2016-06-16
Information query
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