Invention Grant
- Patent Title: High power insulated gate bipolar transistors
- Patent Title (中): 大功率绝缘栅双极晶体管
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Application No.: US14260717Application Date: 2014-04-24
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Publication No.: US09548374B2Publication Date: 2017-01-17
- Inventor: Qingchun Zhang , Sei-Hyung Ryu , Charlotte Jonas , Anant K. Agarwal
- Applicant: Cree, Inc.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel, P.A.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/16 ; H01L29/739 ; H01L21/02 ; H01L21/04 ; H01L21/225 ; H01L21/265 ; H01L21/324 ; H01L29/10

Abstract:
A method of forming a transistor device include forming a drift layer of a first conductivity type, forming a well of a second conductivity type in the drift layer, forming a JFET region with first conductivity type dopant ions in the drift layer, forming a channel adjustment layer of the first conductivity type on the JFET region and the well, implanting first conductivity type dopant ions to form an emitter region of the first conductivity type extending through the channel adjustment layer and into the well, wherein the emitter region is spaced apart from the JFET region by the well, implanting second conductivity type dopant ions to form a connector region of the second conductivity type adjacent the emitter region, forming a gate oxide layer on the channel region, and forming a gate on the gate oxide layer.
Public/Granted literature
- US20150287805A1 High Power Insulated Gate Bipolar Transistors Public/Granted day:2015-10-08
Information query
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