Invention Grant
- Patent Title: Light-emitting diode chip
- Patent Title (中): 发光二极管芯片
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Application No.: US13878673Application Date: 2011-09-28
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Publication No.: US09548433B2Publication Date: 2017-01-17
- Inventor: Stefan Illek , Ulrich Steegmüller , Norwin von Malm
- Applicant: Stefan Illek , Ulrich Steegmüller , Norwin von Malm
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102010048159 20101011
- International Application: PCT/EP2011/066873 WO 20110928
- International Announcement: WO2012/049023 WO 20120419
- Main IPC: H01L31/12
- IPC: H01L31/12 ; H01L33/62 ; H01L27/15

Abstract:
A light-emitting diode chip includes at least two semiconductor bodies, each semiconductor body including at least one active area that generates radiation, a carrier having a top side and an underside facing away from the top side, and an electrically insulating connector arranged at the top side of the carrier, wherein the electrically insulating connector is arranged between the semiconductor bodies and the top side of the carrier, the electrically insulating connector imparts a mechanical contact between the semiconductor bodies and the carrier, and at least some of the semiconductor bodies electrically connect in series with one another.
Public/Granted literature
- US20130299867A1 LIGHT-EMITTING DIODE CHIP Public/Granted day:2013-11-14
Information query
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