Invention Grant
- Patent Title: Devices containing metal chalcogenides
- Patent Title (中): 含有金属硫族化物的装置
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Application No.: US14807030Application Date: 2015-07-23
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Publication No.: US09548450B2Publication Date: 2017-01-17
- Inventor: Sumeet C. Pandey , Gurtej S. Sandhu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L47/00
- IPC: H01L47/00 ; H01L45/00

Abstract:
Some embodiments include a device having a conductive material, a metal chalcogenide-containing material, and a region between the metal chalcogenide-containing material and the conductive material. The region contains a composition having a bandgap of at least about 3.5 electronvolts and a dielectric constant within a range of from about 1.8 to 25. Some embodiments include a device having a first electrode, a second electrode, and a metal chalcogenide-containing material between the first and second electrodes. The device also includes an electric-field-modifying region between the metal chalcogenide-containing material and one of the first and second electrodes. The electric-field-modifying region contains a composition having a bandgap of at least about 3.5 electronvolts having a low dielectric constant and a low conduction band offset relative to a workfunction of metal of the metal chalcogenide-containing material.
Public/Granted literature
- US20160087204A1 Devices Containing Metal Chalcogenides Public/Granted day:2016-03-24
Information query
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