Invention Grant
- Patent Title: Connector with plate and shell
- Patent Title (中): 带板和壳的连接器
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Application No.: US14853262Application Date: 2015-09-14
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Publication No.: US09548568B2Publication Date: 2017-01-17
- Inventor: Toshiharu Miyoshi
- Applicant: HOSIDEN CORPORATION
- Applicant Address: JP Osaka
- Assignee: HOSIDEN CORPORATION
- Current Assignee: HOSIDEN CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-203741 20141002
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R13/6461 ; H01R13/428 ; H01R13/6585 ; H01R13/6596 ; H01R24/60 ; H01R107/00

Abstract:
There are provided a first insulator substrate; a first contact comprising a plurality of contact pins arranged in an array on a top surface of the first insulator substrate; a second insulator substrate; a second contact comprising a plurality of contact pins arranged in an array on an undersurface of the second insulator substrate; a metal plate sandwiched between an undersurface of the first insulator substrate and a top surface of the second insulator substrate; and a metal shell accommodating the first and second insulator substrates, the first and second contacts and the metal plate; wherein the metal plate comprises a pair of protruding parts formed on both ends in an array direction of the contact pins, being oriented toward the outside; and the metal shell comprises a pair of windows to be engaged with the pair of protruding part.
Public/Granted literature
- US20160099523A1 CONNECTOR Public/Granted day:2016-04-07
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