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Invention Grant
US09549471B2 Copper foil composite 有权
铜箔复合材料

Copper foil composite
Abstract:
A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein equation 1: (f3×t3)/(f2×t2)=>1 is satisfied when t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and equation 2: 1
Abstract(Chinese):

包括铜箔和层压在其上的树脂层的铜箔复合体，其中当t2（mm）是铜箔的厚度，f2（mm）时，等式1：（f3×t3）/（f2×t2）=> 1 MPa）是拉伸应变为4％时的铜箔的应力，t3（mm）是树脂层的厚度，f3（MPa）是树脂层在拉伸应变下的应力为4％，式2： 当f1（N / mm）在铜箔和树脂层之间的剥离强度为180°时，满足1 <= 33f1 /（F×T），F（MPa）是拉伸应变下的铜箔复合材料的强度为30％ ，T（mm）为铜箔复合体的厚度。

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