Invention Grant
- Patent Title: Drip-proof structure of electronic apparatus
- Patent Title (中): 电子设备防滴结构
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Application No.: US14659949Application Date: 2015-03-17
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Publication No.: US09549475B2Publication Date: 2017-01-17
- Inventor: Yuuichi Honda , Kazuyuki Sasaki
- Applicant: FANUC Corporation
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Hauptman Ham, LLP
- Priority: JP2014-061725 20140325
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/06 ; H05K7/14

Abstract:
A housing for a module in which a printed circuit board is housed and a housing for a base unit in which a printed circuit board is housed are each provided with an opening for a connector, and a convex portion and/or a concave portion is provided around the connector opening so that a cutting fluid is prevented from dripping and spreading on the connector that electrically connects units such as the module and the base unit.
Public/Granted literature
- US20150282340A1 DRIP-PROOF STRUCTURE OF ELECTRONIC APPARATUS Public/Granted day:2015-10-01
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