The invention relates to a housing for electronic components with the housing comprising at least a front housing part and a rear housing part. The front housing part and the rear housing part are arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear housing part. The housing comprises at least one ventilation opening to prevent build-up of negative pressure inside the housing, where the ventilation opening is covered by a protective covering comprising a through opening. The through opening is arranged to allow water to flow through the through opening, thereby preventing a build up of pressure inside the protective covering. A method for manufacturing a housing according to the invention is also disclosed.