Invention Grant
- Patent Title: Method for populating circuit carriers
- Patent Title (中): 填充电路载体的方法
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Application No.: US14295408Application Date: 2014-06-04
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Publication No.: US09549494B2Publication Date: 2017-01-17
- Inventor: Michael Schmidt
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102013210847 20130611
- Main IPC: G06F7/00
- IPC: G06F7/00 ; H05K13/08 ; H01L23/00 ; H01L21/67

Abstract:
A set of circuit carriers includes a number of N≧1 circuit carriers, each of which has an upper side, an underside opposite from the upper side, a distinctive structure, and a conductor structure on the upper side. Each of the circuit carriers is populated by: determining a first relative position between the distinctive structure and the conductor structure; picking up the circuit carrier by a pickup of a lifting and positioning unit; determining a second relative position between the lifting and positioning unit and the distinctive structure of the circuit carrier picked up by the pickup; and populating the circuit carrier with one or more components while taking the first relative position and the second relative position into account.
Public/Granted literature
- US20140364996A1 Method for Populating Circuit Carriers Public/Granted day:2014-12-11
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