Invention Grant
- Patent Title: Component mounting system
- Patent Title (中): 组件安装系统
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Application No.: US14313107Application Date: 2014-06-24
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Publication No.: US09549495B2Publication Date: 2017-01-17
- Inventor: Shogo Tada , Shin-ichiro Endo , Toru Chikuma , Daisuke Mizokami
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2013-141482 20130705
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/04
Abstract:
A component mounting system includes: a component mounter that moves a mounting head and allows a suction nozzle mounted in the mounting head to suck a component supplied by a parts feeder to mount the component on a substrate; a head maintenance device that executes maintenance of the mounting head; an inspection section that inspects a state of the mounting head undergone the maintenance; a use suitability determination section that determines whether or not use of the mounting head undergone the maintenance is suitable based on a result of the inspection; and a registration section that registers the mounting head determined to be not suitable for use.
Public/Granted literature
- US20150013152A1 COMPONENT MOUNTING SYSTEM Public/Granted day:2015-01-15
Information query
