Invention Grant
- Patent Title: Vertical pressure sensitive structure
- Patent Title (中): 垂直压敏结构
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Application No.: US13368370Application Date: 2012-02-08
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Publication No.: US09550669B2Publication Date: 2017-01-24
- Inventor: Thoralf Kautzsch
- Applicant: Thoralf Kautzsch
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Schiff Hardin LLP
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G01L9/16 ; H01S4/00 ; H01L21/336 ; H01L21/311 ; B81C1/00 ; H04R19/00 ; H04R31/00
Abstract:
Embodiments related to pressure sensitive structures are described and depicted.
Public/Granted literature
- US09254996B2 Vertical pressure sensitive structure Public/Granted day:2016-02-09
Information query
