Invention Grant
US09550723B2 Radically curable compound, method for producing radically curable compound, radically curable composition, cured product of the same, and resist-material composition 有权
自由基固化性化合物,自由基固化性化合物的制造方法,自由基固化性组合物,其固化物和抗蚀材料组合物

  • Patent Title: Radically curable compound, method for producing radically curable compound, radically curable composition, cured product of the same, and resist-material composition
  • Patent Title (中): 自由基固化性化合物,自由基固化性化合物的制造方法,自由基固化性组合物,其固化物和抗蚀材料组合物
  • Application No.: US15259787
    Application Date: 2016-09-08
  • Publication No.: US09550723B2
    Publication Date: 2017-01-24
  • Inventor: Tomoyuki ImadaTakakazu KageDongmi Shin
  • Applicant: DIC Corporation
  • Applicant Address: JP Tokyo
  • Assignee: DIC Corporation
  • Current Assignee: DIC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Locke Lord LLP
  • Priority: JP2012-164813 20120725
  • Main IPC: C08L69/00
  • IPC: C08L69/00 C07C69/54 C08G8/30
Radically curable compound, method for producing radically curable compound, radically curable composition, cured product of the same, and resist-material composition
Abstract:
Provided is a positive photoresist composition excellent in terms of heat resistance. A radically curable compound is represented by a general formula (1) below (where R1, R2, and R3 each independently represent an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; X, Y, and Z each independently represent an acryloyloxy group, a methacryloyloxy group, or a hydroxy group, and at least one of X, Y, and Z represents an acryloyloxy group or a methacryloyloxy group; and t represents 1 or 2).
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