Invention Grant
US09550723B2 Radically curable compound, method for producing radically curable compound, radically curable composition, cured product of the same, and resist-material composition
有权
自由基固化性化合物,自由基固化性化合物的制造方法,自由基固化性组合物,其固化物和抗蚀材料组合物
- Patent Title: Radically curable compound, method for producing radically curable compound, radically curable composition, cured product of the same, and resist-material composition
- Patent Title (中): 自由基固化性化合物,自由基固化性化合物的制造方法,自由基固化性组合物,其固化物和抗蚀材料组合物
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Application No.: US15259787Application Date: 2016-09-08
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Publication No.: US09550723B2Publication Date: 2017-01-24
- Inventor: Tomoyuki Imada , Takakazu Kage , Dongmi Shin
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC Corporation
- Current Assignee: DIC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2012-164813 20120725
- Main IPC: C08L69/00
- IPC: C08L69/00 ; C07C69/54 ; C08G8/30

Abstract:
Provided is a positive photoresist composition excellent in terms of heat resistance. A radically curable compound is represented by a general formula (1) below (where R1, R2, and R3 each independently represent an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; X, Y, and Z each independently represent an acryloyloxy group, a methacryloyloxy group, or a hydroxy group, and at least one of X, Y, and Z represents an acryloyloxy group or a methacryloyloxy group; and t represents 1 or 2).
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