A substrate, such as, for example, a flap member of a pinch-bottom product bag, and a method of making the same, comprises a hot melt adhesive disposed upon the substrate so as to comprise first horizontally spaced upstanding portions whereby adhesive blocking is effectively eliminated or significantly reduced. A fiberized hot melt adhesive overcoat/overspray may also be disposed atop the hot melt adhesive to further assure the elimination or reduction in the adhesive blocking. The fiberized hot melt adhesive may also be used in conjunction with a conventionally applied hot melt adhesive base or foundation upon the substrate or deposited directly onto the substrate.