Invention Grant
- Patent Title: Etching material
- Patent Title (中): 蚀刻材料
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Application No.: US14436287Application Date: 2013-10-11
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Publication No.: US09550940B2Publication Date: 2017-01-24
- Inventor: Hideo Nakako , Yasushi Kumashiro , Takaaki Noudou , Maki Inada , Kyoko Kuroda
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin and Szipl PC
- Priority: JP2012-229276 20121016
- International Application: PCT/JP2013/006074 WO 20131011
- International Announcement: WO2014/061245 WO 20140424
- Main IPC: C09K13/08
- IPC: C09K13/08 ; C09K13/00 ; H01L31/0224 ; H01L21/311 ; H01L31/18
Abstract:
An etching material including at least one boron compound selected from a Lewis acid that includes, in its structure, boron and a halogen that is bonded to the boron, a salt of the Lewis acid and a compound that generates the Lewis acid.
Public/Granted literature
- US20150299568A1 ETCHING MATERIAL Public/Granted day:2015-10-22
Information query
