Invention Grant
US09551729B2 Package, electronic device, method of manufacturing electronic device, electronic apparatus, and moving object
有权
包装，电子装置，制造电子装置的方法，电子装置和运动物体
- Patent Title: Package, electronic device, method of manufacturing electronic device, electronic apparatus, and moving object
- Patent Title (中): 包装，电子装置，制造电子装置的方法，电子装置和运动物体
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Application No.: US14223086Application Date: 2014-03-24
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Publication No.: US09551729B2Publication Date: 2017-01-24
- Inventor: Seiichi Chiba
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2013-071569 20130329
- Main IPC: H05K5/02
- IPC: H05K5/02 ; G01P15/09 ; G01P1/02 ; G01P15/08 ; H03H9/10
Abstract:
A package includes a base portion, and a lid which is placed on the base portion to define an inner space with the base portion and has a metal plate layer and a brazing material layer that is laminated on the metal plate layer, in which the base portion has a metalized layer which is joined with the brazing material layer around the inner space in a plane view, and the brazing material layer has a protrusion which protrudes in a opposite direction of the base portion on an outer peripheral side surface of the metal plate layer.
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