Invention Grant
- Patent Title: Patterning process and resist composition
- Patent Title (中): 图案化过程和抗蚀剂组成
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Application No.: US14144809Application Date: 2013-12-31
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Publication No.: US09551932B2Publication Date: 2017-01-24
- Inventor: Kenji Funatsu , Kentaro Kumaki , Akihiro Seki , Tomohiro Kobayashi , Koji Hasegawa
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2013-012870 20130128
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/38 ; G03F7/038 ; G03F7/039 ; G03F7/40

Abstract:
A resist composition comprising a polymer comprising recurring units having an acid labile group of cyclopentyl with tert-butyl or tert-amyl pendant is coated onto a substrate, baked, exposed to high-energy radiation, PEB and developed in an organic solvent to form a negative pattern. A fine hole pattern can be formed from the resist composition with advantages including high dissolution contrast, good size control and wide depth of focus.
Public/Granted literature
- US20140212808A1 PATTERNING PROCESS AND RESIST COMPOSITION Public/Granted day:2014-07-31
Information query
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