Invention Grant
- Patent Title: Modular device payment system
- Patent Title (中): 模块化设备支付系统
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Application No.: US14971626Application Date: 2015-12-16
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Publication No.: US09552580B2Publication Date: 2017-01-24
- Inventor: Emil Dides , Shereen Kamalie
- Applicant: PAYPAL, INC.
- Applicant Address: US CA San Jose
- Assignee: PayPal, Inc.
- Current Assignee: PayPal, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: G06K5/00
- IPC: G06K5/00 ; G06F7/08 ; G06K19/06 ; G06Q20/36 ; G06Q20/40 ; G07G1/00 ; G06Q20/34 ; G06F1/16 ; G06Q20/32

Abstract:
A modular device payment module includes a chassis. A modular device connector is located on the chassis. A payment module database in the chassis stores funding source information and security information. A payment module engine in the chassis determines that the modular device connector has been connected to a modular device frame of a modular device, and retrieves modular device identifying information from the modular device. The payment module then determines that the modular device identifying information matches an authorized modular device identified by the security information in the payment module database and, in response, enables the transmission of at least some of the funding source information from the payment module database to conduct a payment transaction.
Public/Granted literature
- US20160148196A1 MODULAR DEVICE PAYMENT SYSTEM Public/Granted day:2016-05-26
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