Invention Grant
- Patent Title: Electronic device and covering structure
- Patent Title (中): 电子设备和覆盖结构
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Application No.: US14071652Application Date: 2013-11-05
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Publication No.: US09552847B2Publication Date: 2017-01-24
- Inventor: Jim-Da Lin
- Applicant: Wistron Corporation
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW102132017A 20130905
- Main IPC: G11B33/14
- IPC: G11B33/14 ; G06F1/18 ; H05K9/00

Abstract:
An electronic device including a metal casing and a covering structure is provided. The metal casing has a first opening. The covering structure includes a cover and a conductive component. The cover is assembled to the metal casing and covers the first opening, wherein the cover has at least one hole. The conductive component is fixed to the cover and has at least one contacting portion, wherein the contacting portion passes through the hole and contacts the metal casing, and an electromagnetic wave is adapted to pass through the conductive component to be transmitted to the metal casing.
Public/Granted literature
- US20150062857A1 ELECTRONIC DEVICE AND COVERING STRUCTURE Public/Granted day:2015-03-05
Information query
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