Invention Grant
- Patent Title: Trench vertical NAND and method of making thereof
- Patent Title (中): 沟槽垂直NAND及其制作方法
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Application No.: US14265815Application Date: 2014-04-30
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Publication No.: US09552991B2Publication Date: 2017-01-24
- Inventor: Akira Matsudaira , James Kai , Yuan Zhang , Vinod Purayath , Donovan Lee
- Applicant: SanDisk Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Plano
- Agency: The Marbury Law Group PLLC
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L21/311 ; H01L21/3213 ; H01L21/28

Abstract:
A method of making a monolithic three dimensional NAND string includes providing a stack of alternating first material layers and second material layers different from the first material layer over a substrate, etching the stack to form at least one trench in the stack, forming a blocking dielectric over a side wall of the at least one trench, forming a charge storage layer over the blocking dielectric in the at least one trench, forming a tunnel dielectric over the charge storage layer in the at least one trench and forming a semiconductor channel over the tunnel dielectric in the at least one trench.
Public/Granted literature
- US20150318298A1 TRENCH VERTICAL NAND AND METHOD OF MAKING THEREOF Public/Granted day:2015-11-05
Information query
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