Invention Grant
- Patent Title: Electronic component
- Patent Title (中): 电子元器件
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Application No.: US14611676Application Date: 2015-02-02
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Publication No.: US09553051B2Publication Date: 2017-01-24
- Inventor: Petteri Palm , Holger Torwesten , Manfred Schindler , Boris Plikat
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Muphy, Bilak & Homiller, PLLC
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/538 ; H01L21/48 ; H01L23/31 ; H01L21/56
Abstract:
In an embodiment, an electronic component includes a dielectric layer having a first surface and a second surface, one or more semiconductor dies embedded in the dielectric layer and at least one electrically conductive member. The electrically conductive member includes a first portion and a second portion. The first portion includes a foil including a first metal and the second portion includes an electrodeposited layer including a second metal. The first portion and the second portion are embedded in the dielectric layer.
Public/Granted literature
- US20160225717A1 ELECTRONIC COMPONENT Public/Granted day:2016-08-04
Information query
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