Invention Grant
- Patent Title: Semiconductor device, related manufacturing method, and related electronic device
- Patent Title (中): 半导体器件,相关制造方法及相关电子器件
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Application No.: US14596782Application Date: 2015-01-14
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Publication No.: US09553097B2Publication Date: 2017-01-24
- Inventor: Herb He Huang , Clifford Ian Drowley
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee Address: CN
- Agency: Innovation Counsel LLP
- Priority: CN201410038085 20140126
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L29/417 ; H01L29/66

Abstract:
A semiconductor device includes a substrate, a first transistor, and a second transistor. The first transistor includes a first source terminal formed of a material and connected to a first source, a first drain terminal formed of the material and connected to a first drain, a first gate overlapping a portion of the substrate that is between the first source and the first drain, and a first dielectric layer between the first gate and the substrate. The second transistor includes a control gate formed of the material and overlapping a part of the substrate that is positioned between a second source and a second drain, a second dielectric layer between the control gate and the substrate, a floating gate extending through the second dielectric layer to contact a doped region in the substrate, and an insulating member positioned between the control gate and the floating gate.
Public/Granted literature
- US20150214236A1 SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELECTRONIC DEVICE Public/Granted day:2015-07-30
Information query
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