Invention Grant
- Patent Title: Semiconductor devices including separate line patterns
- Patent Title (中): 半导体器件包括单独的线路图案
-
Application No.: US14858756Application Date: 2015-09-18
-
Publication No.: US09553098B2Publication Date: 2017-01-24
- Inventor: Jang-Hyun You , Hyeong Park , Bongtae Park , Jeehoon Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2013-0024622 20130307
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L23/528 ; H01L23/532 ; H01L29/423 ; H01L29/49 ; H01L29/51 ; H01L29/788

Abstract:
A semiconductor device includes a plurality of lines disposed on a semiconductor substrate, and remaining line patterns disposed spaced apart from the lines on extensions from the lines. The lines include first end-portions adjacent to the remaining line patterns. The remaining line patterns include second end-portions adjacent to the lines. The first end-portions and second end-portions are formed to have mirror symmetry with respect to each other.
Public/Granted literature
- US20160013196A1 SEMICONDUCTOR DEVICES INCLUDING SEPARATE LINE PATTERNS Public/Granted day:2016-01-14
Information query
IPC分类: