Invention Grant
- Patent Title: Back-illuminated sensor chips
- Patent Title (中): 背照式传感器芯片
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Application No.: US15134184Application Date: 2016-04-20
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Publication No.: US09553123B2Publication Date: 2017-01-24
- Inventor: Feng Lin , Quanbao Li , Guo Ye
- Applicant: OmniVision Technologies (Shanghai) Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: OMNIVISION TECHNOLOGIES (SHANGHAI) CO., LTD.
- Current Assignee: OMNIVISION TECHNOLOGIES (SHANGHAI) CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Priority: CN201510197708 20150423
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146

Abstract:
A back-illuminated sensor chip is disclosed, which includes one or more pixel areas each including a plurality of pixels located in a plane and arranged in a matrix. Each pixel area includes: a central portion consisting of a plurality of first pixels located in vicinity of a center of the pixel area; and a peripheral portion surrounding the central portion and consisting of the other pixels in the pixel area than the first pixels. The plurality of first pixels have a first height in a vertical direction perpendicular to the plane, and the pixels in the peripheral portion have a second height in the vertical direction that is greater than the first height so that the peripheral portion protrudes outward beyond the central portion and is thus located nearer to a light source during imaging than the central portion. As a result, light sensibility of the peripheral portion is increased.
Public/Granted literature
- US20160315110A1 Back-Illuminated Sensor Chips Public/Granted day:2016-10-27
Information query
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