Invention Grant
- Patent Title: Semiconductor device having buried layer
- Patent Title (中): 具有掩埋层的半导体器件
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Application No.: US14737874Application Date: 2015-06-12
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Publication No.: US09553142B2Publication Date: 2017-01-24
- Inventor: Yu-Jui Chang , Cheng-Chi Lin
- Applicant: Macronix International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/78 ; H01L29/10

Abstract:
A semiconductor device includes a substrate having a first conductivity type, a high-voltage well having a second conductivity type and disposed in the substrate, a source region disposed in the high-voltage well, a drain region disposed in the high-voltage well and spaced apart from the source region along a first direction, and a buried layer having the second conductivity type and disposed under an area between the source region and the drain region.
Public/Granted literature
- US20160365410A1 SEMICONDUCTOR DEVICE HAVING BURIED LAYER Public/Granted day:2016-12-15
Information query
IPC分类: