Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14620993Application Date: 2015-02-12
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Publication No.: US09553143B2Publication Date: 2017-01-24
- Inventor: Shang-Hui Tu , Yu-Lung Chin , Shin-Cheng Lin
- Applicant: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/423 ; H01L29/78 ; H01L29/66

Abstract:
A semiconductor device includes: a semiconductor substrate; a semiconductor layer disposed over the semiconductor layer; a first well region disposed in the semiconductor layer and the semiconductor substrate; a second well region disposed in the semiconductor layer; a first isolation element disposed in the first well region; a second isolation element disposed in the second well region; a gate structure disposed in the semiconductor layer between the first isolation element and the second isolation element; a first doped region disposed in the first well region; and a second doped region disposed in the second well region. The bottom surface of the gate structure is above, below or substantially level with a bottom surface of the first isolation structure.
Public/Granted literature
- US20160240663A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2016-08-18
Information query
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