Invention Grant
- Patent Title: Light emitting element
- Patent Title (中): 发光元件
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Application No.: US14869667Application Date: 2015-09-29
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Publication No.: US09553237B2Publication Date: 2017-01-24
- Inventor: Hidetoshi Tanaka
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2014-201511 20140930
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/267 ; H01L31/12 ; H01L33/00 ; H01L33/38 ; H01L33/20 ; H01L33/26

Abstract:
A light emitting element includes a semiconductor layer; an upper electrode disposed on an upper surface of the semiconductor layer; and a lower electrode disposed on a lower surface of the semiconductor later. In a plan view, the upper electrode includes a first extending portion extending in an approximately rectangular shape along an outer periphery of the semiconductor layer, a first pad portion connected to a first side among four sides of the first extending portion, a second pad portion connected to a second side that is opposite to the first side, among the four sides of the first extending portion, and a second extending portion and a third extending portion, each disposed in a region surrounded by the first extending portion, the second extending portion and the third extending portion each connecting the first pad portion and the second pad portion.
Public/Granted literature
- US20160093774A1 LIGHT EMITTING ELEMENT Public/Granted day:2016-03-31
Information query
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