Invention Grant
- Patent Title: Memory cells and semiconductor structures including electrodes comprising a metal, and related methods
- Patent Title (中): 包含金属的电极的存储单元和半导体结构及相关方法
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Application No.: US14726779Application Date: 2015-06-01
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Publication No.: US09553264B2Publication Date: 2017-01-24
- Inventor: Dale W. Collins , Marko Milojevic , Scott E. Sills , Si-Young Park
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
Memory cells (e.g., CBRAM cells) include an ion source material over an active material and an electrode comprising metal silicide over the ion source material. The ion source material may include at least one of a chalcogenide material and a metal. Apparatuses, such as systems and devices, include a plurality of such memory cells. Memory cells include an adhesion material of metal silicide between a ion source material and an electrode of elemental metal. Methods of forming a memory cell include forming a first electrode, forming an active material, forming an ion source material, and forming a second electrode including metal silicide over the metal ion source material. Methods of adhering a material including copper and a material including tungsten include forming a tungsten silicide material over a material including copper and treating the materials.
Public/Granted literature
- US20150295171A1 MEMORY CELLS AND SEMICONDUCTOR STRUCTURES INCLUDING ELECTRODES COMPRISING A METAL, AND RELATED METHODS Public/Granted day:2015-10-15
Information query
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