Invention Grant
US09553394B2 Connector with plurality of circuit board cable assemblies and overmold
有权
具有多个电路板电缆组件和包覆成型的连接器
- Patent Title: Connector with plurality of circuit board cable assemblies and overmold
- Patent Title (中): 具有多个电路板电缆组件和包覆成型的连接器
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Application No.: US14648482Application Date: 2013-12-02
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Publication No.: US09553394B2Publication Date: 2017-01-24
- Inventor: Kok Hoe Lee , Saujit Bandhu
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Robert S. Moshrefzadeh
- International Application: PCT/US2013/072601 WO 20131202
- International Announcement: WO2014/099331 WO 20140626
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R13/506 ; H01R13/66 ; H01R13/6592 ; H01R13/719
Abstract:
A connector assembly includes a housing, a plurality of circuit board cable assemblies, and an overmold. Each of the circuit board cable assemblies includes a printed circuit board and a pair of shielded cables. The overmold extends and insulate a portion of the shielded cables and a portion of the printed circuit board that includes a plurality of conductive contact pads for electrical connection to the shielded cables.
Public/Granted literature
- US20150318642A1 CONNECTOR ASSEMBLY Public/Granted day:2015-11-05
Information query
