Invention Grant
US09553549B2 Hybrid power amplifier having electrical and thermal conduction path
有权
具有电和热传导路径的混合功率放大器
- Patent Title: Hybrid power amplifier having electrical and thermal conduction path
- Patent Title (中): 具有电和热传导路径的混合功率放大器
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Application No.: US14289591Application Date: 2014-05-28
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Publication No.: US09553549B2Publication Date: 2017-01-24
- Inventor: Young Kwon , David Bockelman , Marshall Maple , Joo Min Jung
- Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H03F3/14
- IPC: H03F3/14 ; H03F1/30 ; H03F3/19 ; H03F3/21 ; H03F1/02 ; H03F3/195 ; H03F3/24 ; H03F3/45 ; H01L23/48

Abstract:
A heterojunction bipolar transistor (HBT) hybrid type RF (radio frequency) power amplifier includes a first device including an input terminal for receiving an RF signal, a pre-driver stage for amplifying the received RF signal, and an output terminal, the input terminal, the pre-driver stage and the output terminal being disposed in or over a first substrate; and a second device having a main stage having an HBT amplifier circuit disposed in or over a second substrate to further amplify the RF signal amplified by the pre-driver stage. The RF signal further amplified by the main stage is output through the output terminal of the first device.
Public/Granted literature
- US20150349723A1 HYBRID POWER AMPLIFIER HAVING ELECTRICAL AND THERMAL CONDUCTION PATH Public/Granted day:2015-12-03
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